|
|
 |
|
| |
| Liquid Sources |
|
Hong Kong Specialty Gases markets ultrahigh purity chemicals and their associated delivery hardware for the semiconductor and related industries. Chemical products include 7-9's+% and 8-9's+% purity liquid and solid source chemicals. These products are purified using our unique purification processes. Ultraclean container cleanliness is achieved using our exclusive cleaning process. The combination of these two processes yield the most consistent, highest purity chemicals in the industry at the point-of-connection. Additional process control exists in manufacturing with our comprehensive quality control system. This is used to monitor and control critical variables and processing at all levels of manufacturing, quality control and administration.
|
| Primary Line Of Liquid Source From Hong Kong Specialty Gases |
| Dielectric CVD Liquid Sources: |
TEOS, TMP, TMB,TEP, TEB, TEPO, TMPO, DES, TMCTS, TTMSB,TTMSP, Ta Ethoxide and other application specific materials. |
| Boron Nitride Sources: |
Borazine |
| Conductor CVD Sources: |
TiCl4, TEAT, TMAT, Cu^I and Cu^II sources, Al sources, and other molecular-tailored compounds. |
| Etch & Diffusion Sources: |
TCA, POCI3, BBR3, PBr3, CCI4, CHCI3, SiCI4 and others. |
| Delivery Hardware: |
Stainless Steel (SS) ampules, SS 5 gallon canisters, quartz bubblers temperature controllers, bulk chemical delivery cabinets, level sensing systems, manual and autorefill systems, and other application specific hardware. |
| HSG Custom Services: |
Custom SS and quartz delivery hardware fabrication, custom bulk refill systems, container cleaning, hardware repair and other services. |
|
| Quartz Bubblers and Stainless Steel Ampule |
| Hong Kong Specialty Gases offers a wide variety of industry standard high purity quartz bubblers. Our innovative bubblers incorporate the newest, most advanced designs in the industry. We manufacture our bubblers with only the highest purity quartz available and the most reliable Teflon valves in the industry. We has invested significant resources into the development of our state-of-the-art designs. Our industry standard bubblers are compatible with nearly all temperature controllers on the market. As the industry demands for CVD and plasma etch processing developed, additional requirements and concerns surfaced. These demands have led to stainless steel (SS) ampule designs that were required to meet the rapidly changing needs of original equipment manufacturers and end users. Therefore, we has expended significant R&D and manufacturing effort to offer optimum SS delivery systems to the industry. Below please find data for the most popular liquid chemicals and hardware products offered by Hong Kong Specialty Gases. Please contact us for additional information regarding your specific requirement. |
| Tetraethylorthosilicate (TEOS) |
Application:
|
| TEOS has been widely used in integrated circuit manufacturing operations to form silicon dioxide films. These conformal films are generated upon the molecular decomposition of TEOS at elevated temperatures and reduced pressures (LPCVD) or at lower temperatures in Plasma Enhanced and Atmospheric Pressure reactors (PECVD, APCVD).
TEOS is typically used for undoped and doped interlayer dielectrics, intermetal dielectrics, sidewall spacers and trench filling applications. TEOS is a stable, non-pyrophoric, non-corrosive liquid, and thereby is a preferable alternative to current processing techniques employing silane or dichlorosilane compounds. The high purity level of our ULSI Grade TEOS is preserved by supplying this material directly to the application in our stainless steel delivery systems.
|
| <more detail> |
|
| Trimethylphosphite (TMP) |
Application:
|
| Trimethylphosphite is an organic phosphorus ester compound which has been widely used as a phosphorus source in the deposition of doped silicate glasses. Phosphorus and boron act as glass flow temperature modifiers. The softening temperature of BPSG films is modulated by varying concentrations of doping constituents. The phosphorus source of doped glass has traditionally been phosphine.
Trimethylphosphite has gained significant acceptance in these applications because of the ease of handling a liquid source, less health hazards, improved purity levels, and improved performance characteristics. Phosphine is a highly dangerous compound which also creates step coverage problems when depositing phosphorus doped silicate glasses. Trimethyphosphite is a liquid at room temperature and has a relatively high vapor pressure that allows for bubbling with a carrier gas, or vacuum processing.
|
| <more detail> |
|
| Trimethylborate (TMB) |
Application:
|
| Trimethylborate is an organic borate ester compound which has been widely used as a boron source in the deposition of doped silicate glasses in low pressure and plasma enhanced CVD. Boron and Phosphorus act as glass flow temperature modifiers. The softening temperature of silicate glasses is modified with varying concentrations of doping constituents. The boron source for doped silicate glasses has traditionally been diborane.
Trimethylborate has gained significant acceptance in these applications. Benefits of TMB include the ease of handling a liquid source,less health hazards, improved purity levels, and improved performance characteristics. TMB is a liquid at room temperature and has a relatively high vapor pressure that allows for bubbling with a carrier gas, vacuum processing, or direct liquid injection.
|
| <more detail> |
|
| Triethylborate (TEB) |
Application:
|
| Triethylborate is an organic borate ester compound which can be used as a boron source in the deposition of doped silicate glasses in low pressure and plasma enhanced CVD. Boron and phosphorus act as glass flow temperature modifiers. The softening temperature of silicate glasses is modified by varying concentrations of doping constituents. The boron source for doped silicate glasses has traditionally been diborane. Triethylborate has been considered as a replacement for diborane and Trimethylborate. Benefits of TEB include the ease of handling a liquid source, less health hazards, improved purity levels and improved performance characteristics over diborane. TEB is a Liquid at room temperature and pressure and has a relatively high vapor pressure that allows for bubbling with a carrier gas or vacuum processing. |
| <more detail> |
|
| Triethylphosphate (TEPO) |
Application:
|
| TEPO is an organic phosphorus ester compound which has been used as a phosphorus source in the deposition of doped silicate glasses. Phosphorus and boron act as glass flow temperature modifiers. The softening temperature of silicate glasses is modified with varying concentrations of doping constituents. The phosphorus source for doped silicate glasses has traditionally been phosphine. TEPO has been considered as a replacement for phosphine, Trimethylphosphite (TMP), and Triethylphosphite (TEP). Benefits of TEPO over phosphine include the ease of handling a liquid source, less health hazards, improved purity levels and improved performance characteristics. TEPO is a liquid at room temperature and pressure and has a low vapor pressure that almost requires bubbling with a carrier gas. |
| <more detail> |
|
| Dichloromethane (DCM) |
Application:
|
| Dichloromethane (DCM) considered as a replacement for Trichloroethane (TCA), which is currently used as a HCI source for oxidation processes. TCA has been identified by the Montreal Protocol and U.S. Clean Air Act as an ozone depleting chemical. This action has prompted semiconductor manufacturers to find a drop-in replacement for TCA without having to return to HCI. |
| <more detail> |
|
| 1,1,1-Trichloroethane (TCA) |
Application:
|
| Trichloroethane is a chlorinated hydrocarbon that has gained wide acceptance in the semiconductor industry as a liquid source substitute for cylinder Hydrogen Chloride (HCI) gas. HCI gas and TCA are used as chlorine sources for thermal oxidation of silicon and for furnace tube cleaning. TCA has become the recognized industry alternative for cylinder HCI gas. The benefits of TCA include improved purity levels, low pressure applications, significantly less safety hazards, ease of handling a liquid source, and TCA is non-corrosive to process equipment. |
| <more detail> |
|
| Phosphorus Oxychloride (POCl3) |
Application:
|
| Phosphorus Oxychloride applications range from MOS and Bipolar dopant processing to glass doping in the fiber optics industry. POCI3 is the industry standard for N-type doping requirements. For years gaseous Phosphine (PH3) was used as the predominant phosphorus source. Phosphine, however, has significant process control difficulties due to impurity levels and water generation upon decomposition reaction. Phosphorous Oxychloride has significantly displaced Phosphine as the phosphorous source due to the ease of handling liquid source, high purity levels, dry decomposition chemisty, and overall process control capabilities. |
| <more detail> |
|
| Trans 1,2-Dichloroethylene (DCE) |
| <more detail> |
| |
 |
|
| |
|
| |
|
|
